This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Windmoeller & Hoelscher Kg. Active years: 2006.
Company Filing History:
Years Active: 2006
Title: Andrees Erdmann: Innovator in Glue Application Technology
Introduction
Andrees Erdmann is a notable inventor based in Osnabrueck, Germany. He has made significant contributions to the field of glue application technology, particularly in the design of paste units for bottom guide devices. His innovative approach has led to the development of a unique patent that enhances the efficiency of gluing processes.
Latest Patents
Erdmann holds a patent for a "Paste unit for a bottom guide device." This invention is designed for gluing bottom warps or star seal bottom bags, which are formed from tube sections. The paste unit features an interchangeable glue reservoir and glue source nozzle, a metering roller, a glue application roller, and a making roller. The drive mechanisms assigned to the rollers ensure precise operation. The glue is transferred to the printing roller by the glue application roller, allowing for even application and fine adjustment of the metering. The system can operate in a closed manner with the glue reservoir or as an open system with the glue source nozzle, catering to various types of glue.
Career Highlights
Throughout his career, Andrees Erdmann has worked with prominent companies in the industry. He has been associated with Windmoeller & Hoelscher and Ruediger Duwendag, where he has honed his skills and contributed to various projects. His experience in these organizations has played a crucial role in shaping his innovative ideas.
Collaborations
Erdmann has collaborated with notable individuals in his field, including Guido Kerres and Ruediger Duwendag. These partnerships have allowed him to exchange ideas and further develop his inventions.
Conclusion
Andrees Erdmann's contributions to glue application technology through his innovative patent demonstrate his expertise and commitment to advancing the industry. His work continues to influence the efficiency of gluing processes in manufacturing.
