Hamburg, Germany

Andreas Westphal

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Hamburg, DE (1996 - 2010)
  • Neu Wulmstorf, DE (2017 - 2020)

Company Filing History:


Years Active: 1996-2020

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Andreas Westphal

Introduction

Andreas Westphal is a notable inventor based in Hamburg, Germany. He has made significant contributions to the field of adhesive technologies, holding a total of six patents. His work focuses on developing advanced adhesive compositions and multi-layer laminates that enhance performance in various applications.

Latest Patents

Westphal's latest patents include a self-adhesive compound designed for use in adhesive tapes. This invention features a self-adhesive composition that incorporates at least one elastomer, specifically a polybutadiene block copolymer, along with partially hydrogenated hydrocarbon resins and additional additives. Another notable patent is for a multi-layer laminate with high internal damping, which is intended for the production of membranes for electroacoustic transducers. This composite consists of multiple layers, including cover layers and damping layers, each with distinct glass transition temperatures.

Career Highlights

Throughout his career, Westphal has worked with prominent companies such as Tesa SE and Beiersdorf AG. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to innovative product development.

Collaborations

Westphal has collaborated with several professionals in his field, including Peter Gleichenhagen and Marc Husemann. These partnerships have facilitated the exchange of ideas and advancements in adhesive technology.

Conclusion

Andreas Westphal's contributions to adhesive technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative work continues to impact the development of advanced adhesive solutions.

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