Hagen, Germany

Andreas Kupczyk


 

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 1990-1997

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5 patents (USPTO):Explore Patents

Title: The Innovations of Andreas Kupczyk

Introduction

Andreas Kupczyk is a notable inventor based in Hagen, Germany. He has made significant contributions to the field of heat-shrinkable materials, holding a total of 5 patents. His innovative designs have paved the way for advancements in packaging and material technology.

Latest Patents

Among his latest patents is the "Heat-shrinkable envelope," which features at least one shrinkable surface layer and a reinforcing insert made from a grid of plastic. This grid is designed to shrink in the same direction as the shrinkable layer, enhancing the envelope's functionality. Another notable patent is the "Heat-shrinkable composite foil," which consists of a shrinkable composite section formed from two planar foils that adhere firmly to one another. Each foil has a shrink direction at an offset angle relative to the other, reducing the tendency for tearing in the composite foil section.

Career Highlights

Andreas has worked with companies such as RXS Schrumpftechnik-Garnituren GmbH and RXS Schrumpftechnik-Carnituren GmbH. His experience in these organizations has contributed to his expertise in the development of heat-shrinkable technologies.

Collaborations

Throughout his career, Andreas has collaborated with professionals like Christian Kipfelsberger and Hans Winterhoff. These partnerships have further enriched his work and innovations in the field.

Conclusion

Andreas Kupczyk's contributions to heat-shrinkable materials demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of material science and practical applications, making him a significant figure in his field.

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