Dresden, Germany

Andreas Bischof

This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2007-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andreas Bischof. Retrieved from https://idiyas.com/inventor/andreas-bischof-gr7eacbf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: Innovations by Andreas Bischof: A Focus on Semiconductor Packaging

Introduction

Andreas Bischof is an inventive mind based in Dresden, Germany, who has made significant contributions to the field of semiconductor technology. With two patents to his name, Bischof is a key player in driving innovation forward, particularly through his work at Infineon Technologies AG. He is known for his ability to tease out new methods that improve efficiency and performance in semiconductor applications.

Latest Patents

Bischof's latest patents showcase his innovative approach to semiconductor packaging. The first patent details a method of producing a package for semiconductor chips. This inventive method is centered around the idea of temporarily releasing the mechanical connection between the semiconductor chip and its supporting substrate during manufacturing. By doing this, a critical interface in the packaging is removed, which leads to a significant reduction in thermomechanical stresses.

The second patent describes a handling unit for electronic devices, comprising a frame, at least one arrangement module, and at least one chip carrier. The frame includes at least one recess for the interchangeable mounting of the arrangement modules, while the arrangement module features a receptacle for the mounting of at least one chip carrier. The chip carrier itself is designed with at least one seat capable of holding a chip, thereby facilitating efficient handling and placement of semiconductor components.

Career Highlights

Andreas Bischof's career is highlighted by his role at Infineon Technologies AG, a prominent company in the semiconductor industry. His contributions have not only led to the development of innovative packaging solutions but have also enhanced operational efficiencies across various applications within the industry.

Collaborations

Bischof collaborates closely with other talented professionals in his field, including Knut Kahlisch and Henning Mieth. These collaborative efforts have enabled him to explore new frontiers in technology, ensuring that Infineon remains at the forefront of semiconductor innovation.

Conclusion

Through his patents and collaborative efforts, Andreas Bischof exemplifies the spirit of innovation in the semiconductor industry. His contributions reflect a deep understanding of the technical challenges faced in the field and a commitment to developing solutions that push the boundaries of what is possible in semiconductor technology. As the industry continues to evolve, Bischof's work will likely play a critical role in shaping its future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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