Andreas Alfred Hase

Title: Innovations of Andreas Alfred Hase

Introduction

Andreas Alfred Hase is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology. His work focuses on enhancing the functionality and efficiency of electronic devices through advanced packaging solutions.

Latest Patents

One of Hase's latest patents is a QFN/SON compatible package with SMT land pads. This leadless package and its manufacturing method allow for hermetic sealing of devices while maintaining electrical and optical access. The design incorporates micro-vias with feed-through metallization through a silicon structure, facilitating a surface mount technology-compatible silicon package. The package features bottom SMT pads and top surface device integration, with sloped edges enabling solder filleting for post-solder inspection. The hermetic seal can be achieved using anodic bonding of a glass lid or metal soldering, which also allows for the use of solder bumps for electrical connections. This innovation eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing multiple discrete devices.

Another significant patent by Hase is for a package designed for a light-emitting element. This high-brightness LED module includes a substrate with a recess where the light-emitting element is mounted. The recess is defined by sidewalls and a relatively thin membrane, which contains at least two micro-vias with conductive material passing through it. The p-contact of the light-emitting element is coupled to a first micro-via, while the n-contact is coupled to a second micro-via, enhancing the efficiency of the LED module.

Career Highlights

Throughout his career, Hase has worked with prominent companies in the semiconductor industry, including TSMC Solid State Lighting Ltd. and Taiwan Semiconductor Manufacturing Company Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging and innovation.

Collaborations

Hase has collaborated with notable professionals in his field, including Thomas Murphy and Matthias Heschel. These collaborations have further enriched his work and contributed to the development of advanced technologies in semiconductor packaging.

Conclusion

Andreas Alfred Hase is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the industry. His innovative patents reflect his commitment to enhancing electronic device functionality and efficiency.