Andjelko Illick

Title: Andjelko Illick: Innovator in Circuit Board Technology

Introduction

Andjelko Illick is a notable inventor based in Downey, California. He has made significant contributions to the field of electronics, particularly in the development of advanced circuit board technology. His innovative approach has led to the creation of a unique patent that enhances the manufacturing process of printed wiring boards.

Latest Patents

Andjelko Illick holds a patent for a multi-layered circuit board. This invention features a layered clad laminate with a universal center plane, designed for the manufacture of printed wiring boards. The patent describes an electrically conductive self-sustaining, integral metal center sheet that includes a series of predetermined patterns of punched or photochemically developed openings. This sheet is pressed between electrical insulating layers of resin-impregnated reinforcing material, ensuring that the layers are adhered to each other through the openings. Additionally, each outer surface of the laminate is covered with a layer of electrically conductive metal foil, which is uniform and imperforate.

Career Highlights

Andjelko Illick is currently employed at The Mica Corporation, where he continues to innovate and develop new technologies in the electronics sector. His work has been instrumental in advancing the capabilities of circuit board manufacturing, making it more efficient and effective.

Collaborations

Andjelko collaborates with Harshad K Patel, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Andjelko Illick's contributions to circuit board technology exemplify the spirit of innovation. His patent for a multi-layered circuit board showcases his expertise and commitment to advancing the electronics industry. Through his work at The Mica Corporation, he continues to push the boundaries of what is possible in circuit board manufacturing.