This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Infineon Technologies Canada Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: An-Sheng Cheng: Innovator in Embedded Die Packaging Technology
Introduction
An-Sheng Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of embedded die packaging for power semiconductor devices. His innovative approach has the potential to enhance the performance and reliability of semiconductor devices.
Latest Patents
An-Sheng Cheng holds a patent for "Embedded die packaging of power semiconductor devices." This patent describes a unique packaging method that includes a laminated body composed of multiple dielectric and conductive metal layers. The design features a thermal contact area on the back side of the die, which is attached to a leadframe. Additionally, a patterned layer of conductive metallization on the front side of the die provides essential electrical contact areas. A protective dielectric layer is also included to safeguard the edges of the die during the lamination process, mitigating potential damage.
Career Highlights
An-Sheng Cheng is currently employed at Infineon Technologies Canada Inc., where he continues to develop innovative solutions in semiconductor technology. His work focuses on improving the efficiency and durability of power semiconductor devices, which are critical components in various electronic applications.
Collaborations
An-Sheng Cheng collaborates with Stephen Coates, a fellow innovator in the field. Their combined expertise contributes to advancements in semiconductor packaging technologies.
Conclusion
An-Sheng Cheng's contributions to embedded die packaging technology exemplify the importance of innovation in the semiconductor industry. His work not only enhances device performance but also paves the way for future advancements in the field.