Amye L Wells

Title: Amye L Wells: Innovator in Substrate Technology

Introduction

Amye L Wells is a prominent inventor based in Underhill, Vermont, known for her contributions to substrate technology. With a total of 3 patents, she has made significant advancements in the field, particularly in the use of photoresist materials.

Latest Patents

One of her latest patents focuses on the "Use of photoresist in substrate vias during backside grind." This innovative structure and method of formation involves a substrate with front and back surfaces. The substrate features a backside portion that extends from the back surface to a specific depth, measured from the front surface. At least one via is formed in the substrate, extending from the front surface to a defined via depth. Each via depth is less than the initial thickness of the substrate, ensuring that the second depth does not exceed the minimum via depth. Organic material, such as photoresist, is inserted into each via, which is then covered with tape. Following this, the backside portion of the substrate is removed, and the tape is taken off the organic material, allowing for the removal of the organic material from each via.

Career Highlights

Amye L Wells is currently employed at International Business Machines Corporation (IBM), where she continues to innovate and develop new technologies. Her work has been instrumental in enhancing the efficiency and effectiveness of substrate manufacturing processes.

Collaborations

Throughout her career, Amye has collaborated with notable colleagues, including Timothy Charles Krywanczyk and Donald W Brouillette. These partnerships have contributed to her success and the advancement of her projects.

Conclusion

Amye L Wells is a trailblazer in the field of substrate technology, with her innovative patents paving the way for future advancements. Her work at IBM and collaborations with esteemed colleagues highlight her significant impact on the industry.