This inventor holds 3 USPTO granted patents. Top assignee: Advanced Micro Devices Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Amorn Hongmala: Innovator in Integrated Circuit Package Orientation
Introduction
Amorn Hongmala is a notable inventor based in Phatthalung, Thailand. He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and accuracy of package orientation detection systems.
Latest Patents
One of his latest patents is titled "Method and system for detection of integrated circuit package orientation in a tape and reel system." This invention describes a digital circuit that operates over a carrier rail of a tape and reel system. The digital circuit is designed to detect package orientation based on the chamfer side of packages within the tape. It incorporates at least two optical sensors that emit a light beam and sense the reflection of that beam for each package, facilitating automated orientation detection.
Another significant patent is "Method and system for package orientation checking for laser mark operations." This system includes a handler with a unit loader and a laser mark chamber that receives units for laser marking. A package orientation checking mechanism is strategically positioned between the unit loader and the laser mark chamber to detect the orientation of each unit based on its chamfer side.
Career Highlights
Amorn Hongmala is currently employed at Advanced Micro Devices Corporation, where he continues to innovate in the field of integrated circuits. His work has contributed to advancements in automated systems for package handling and marking.
Collaborations
He has collaborated with notable coworkers such as Somboon Sritulanont and Naramitr Jitramas, further enhancing the innovative efforts within his team.
Conclusion
Amorn Hongmala's contributions to integrated circuit package orientation detection demonstrate his commitment to innovation in technology. His patents reflect a deep understanding of the complexities involved in automated systems, making him a valuable asset in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile