St. Charles, MO, United States of America

Amoret M Chappell



 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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5 patents (USPTO):Explore Patents

Title: Innovations of Amoret M Chappell

Introduction

Amoret M Chappell is a notable inventor based in St. Charles, MO (US), recognized for his contributions to the field of thermal protection materials. With a total of five patents to his name, Chappell has made significant advancements in the development of high-temperature fabrics.

Latest Patents

Chappell's latest patents include a groundbreaking invention of a single-layer ceramic-based knit fabric designed for high-temperature bulb seals. This innovative fabric incorporates ceramic strands and thermal protective members, showcasing methods of construction that allow for the concurrent knitting of high-temperature ceramic fibers with load-relieving process aids. These aids can be inorganic or organic materials, such as metal alloys or polymers. The design enables the integration of both small and large diameter wires within the knit, providing structural support and facilitating the creation of near net-shape preforms at production-level speeds. Additionally, the concurrent integration of ceramic insulation enhances thermal protection.

Career Highlights

Chappell is currently employed at The Boeing Company, where he applies his expertise in materials science to develop advanced thermal protection solutions. His work has been instrumental in improving the performance and safety of aerospace components.

Collaborations

Chappell collaborates with talented coworkers, including Tiffany A Stewart and Christopher Paul Henry, contributing to a dynamic team focused on innovation in thermal protection technologies.

Conclusion

Amoret M Chappell's innovative work in high-temperature fabrics and thermal protection has positioned him as a key figure in the field. His patents reflect a commitment to advancing material science, particularly in aerospace applications.

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