Raleigh, NC, United States of America

Alyssa Smith

This inventor holds 1 USPTO granted patent. Top assignee: Meadwestvaco Corporation. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alyssa Smith. Retrieved from https://idiyas.com/inventor/alyssa-smith-aq865nmd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Innovations by Alyssa Smith in Security Packaging

Introduction

Alyssa Smith is an accomplished inventor based in Raleigh, NC. She has made significant contributions to the field of packaging technology, particularly in enhancing security measures for products. Her innovative approach has led to the development of a unique patent that addresses critical issues in theft prevention.

Latest Patents

Alyssa holds a patent for "Paperboard Security Packages." This invention features advanced characteristics that provide increased resistance against theft by preventing or slowing the opening of the package. This innovation is particularly valuable in retail and shipping industries, where product security is paramount.

Career Highlights

Alyssa Smith is associated with Meadwestvaco Corporation, a company known for its commitment to innovative packaging solutions. Her work at the corporation has allowed her to focus on developing technologies that enhance the safety and security of packaged goods.

Collaborations

Due to space constraints, the details of Alyssa's collaborations will not be included.

Conclusion

Alyssa Smith's contributions to security packaging through her patent demonstrate her commitment to innovation and her ability to address real-world challenges. Her work continues to influence the packaging industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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