Company Filing History:
Years Active: 2019
Title: Allen Ben Chu: Innovator in Heat Sink Technology
Introduction
Allen Ben Chu is a notable inventor based in Dunlap, IL (US). He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of power modules.
Latest Patents
Allen Ben Chu holds a patent for a heat sink assembly. This assembly is designed for a power module and features a main body that includes both a first cooling circuit and a second cooling circuit. The first cooling circuit consists of a first plurality of channels, at least one first end channel, at least one second end channel, a first inlet, and a first outlet. This circuit is engineered to facilitate a first flow of coolant through the main body. The second cooling circuit comprises a second plurality of passages, at least one first end passage, at least one second end passage, a second inlet, and a second outlet. It is designed to provide a second flow of coolant through the main body. Notably, both cooling circuits are adapted to create a cross flow of the first and second flows through the main body, enhancing the overall cooling efficiency.
Career Highlights
Allen Ben Chu is currently employed at Caterpillar Inc., where he applies his expertise in thermal management. His innovative approach to heat sink technology has positioned him as a valuable asset within the company. His work contributes to the development of more efficient power modules, which are essential in various applications.
Collaborations
Throughout his career, Allen has collaborated with talented individuals such as Keith Elliot Dixler and Jon Nathaniel Husser. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Allen Ben Chu is a distinguished inventor whose work in heat sink technology has made a significant impact on the efficiency of power modules. His contributions at Caterpillar Inc. and his innovative patent demonstrate his commitment to advancing thermal management solutions.