Alice Huang

Title: The Innovative Mind of Alice Huang: Pioneering Integrated Circuit Packaging

Introduction: Alice Huang is an accomplished inventor hailing from Hsinchu, Taiwan. With a strong focus on advancing technology in the semiconductor industry, she has made significant contributions to the field of integrated circuit packaging. Her innovative work has garnered recognition, highlighted by her patent that addresses common challenges faced in chip packaging.

Latest Patents: Alice Huang holds a patent for an "Interposer with Warpage-Relief Trenches," which presents a method for forming an integrated circuit (IC) chip package structure. This invention provides a novel approach by incorporating a conductive interconnect structure in and on a substrate for connecting a group of selected IC dies. The patent details the formation of warpage-reducing trenches in non-routing regions of the interposer, meticulously sized and positioned based on specific warpage characteristics. This design aims to minimize warpage, thereby enhancing the reliability and efficiency of chip package structures. Additionally, a warpage-relief material is deposited within these trenches, further addressing the warpage issues associated with IC packaging.

Career Highlights: Alice Huang's career is marked by her role at Taiwan Semiconductor Manufacturing Company Limited, where she has been a part of a pioneering team dedicated to pushing the boundaries of semiconductor technology. Her expertise and inventive spirit have significantly influenced the development of innovative packaging solutions for integrated circuits.

Collaborations: During her tenure at the Taiwan Semiconductor Manufacturing Company Limited, Alice has had the opportunity to collaborate with talented professionals in her field, including her coworker, Tsung-Yang Hsieh. Together, they have worked on various projects that seek to enhance the performance and functionality of semiconductor devices, underlining the importance of teamwork in driving innovation.

Conclusion: Alice Huang stands out as a prominent figure in the realm of innovations in integrated circuit packaging. With her patent for the interposer with warpage-relief trenches, she has significantly contributed to the advancement of semiconductor technology. Her career at Taiwan Semiconductor Manufacturing Company Limited and collaborative efforts reflect her dedication to innovation, making her an influential inventor in the semiconductor industry.