Alice Guerrero

Title: The Innovative Contributions of Alice Guerrero

Introduction

Alice Guerrero is a prominent inventor based in Overijse, Belgium. She has made significant strides in the field of thermocompression bonding technology. Her work focuses on addressing challenges faced by manufacturers in the semiconductor industry.

Latest Patents

Alice Guerrero holds a patent for a "Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding." This invention is crucial for achieving both homogeneous and heterogeneous integration for 2.5D and 3D integrated circuits. The technology involves bonding a landing wafer or substrate with a carrier using a temporary bonding material. This process is essential before thinning the landing wafer to the desired thickness. The invention addresses the deformation of lead-free solder alloys during thermocompression bonding, which is a common issue for manufacturers.

Career Highlights

Alice Guerrero is currently employed at Brewer Science, Inc., where she continues to innovate in the field of semiconductor technology. Her expertise and contributions have positioned her as a key player in her industry.

Collaborations

Alice has collaborated with notable colleagues, including Chia-Hsin Lee and Arthur O Southard. These partnerships have further enhanced her research and development efforts.

Conclusion

Alice Guerrero's innovative work in thermocompression bonding technology exemplifies her commitment to advancing the semiconductor industry. Her contributions are vital for improving manufacturing processes and ensuring the reliability of integrated circuits.