Düsseldorf, Germany

Ali Kaylan

This inventor holds 5 USPTO granted patents and 2 EPO patents. Top assignees: Sig Services Ag, Sig Technology Ag. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ali Kaylan. Retrieved from https://idiyas.com/inventor/ali-kaylan-1pfu04tj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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5 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Ali Kaylan**

Introduction:

Ali Kaylan is a distinguished inventor based in Duesseldorf, Germany. With a notable portfolio of four patents, he has made significant contributions to the field of composite materials and packaging design. His innovative approaches have paved the way for more efficient and versatile packaging solutions in various industries.

Latest Patents:

Ali Kaylan's latest patents include groundbreaking developments in flat-shaped composite materials and packaging designs. His work on a **flat-shaped composite material** describes a manufacturing process for packages that incorporates a polymer outer layer, a polymer inner layer, and a fibrous support layer. This composite is designed with several fold lines that facilitate the creation of a closed package by folding along these lines. The unique configuration allows for the production of packages with complex geometries without compromising rigidity. Furthermore, his invention includes a **package sleeve** made from the composite material, which aids in the crafting of packages featuring curved edges and intricate designs.

Another noteworthy patent is the **package with stress-relief panels**, which presents a novel approach to package design. This package consists of a base with distinct corners, a gable, and a base body comprising panels. The inclusion of stress-relief panels positioned strategically between the front panel and side panels enables manufacturers to create packages with advanced geometries while maintaining the overall strength and functionality of the packages.

Career Highlights:

Throughout his career, Ali Kaylan has collaborated with reputable companies such as Sig Technology AG and Sig Services AG. His innovative solutions have been instrumental in enhancing packaging technologies, demonstrating his expertise and dedication to advancing the field.

Collaborations:

In his journey as an inventor, Ali has worked alongside skilled professionals like Norman Gierow and Thomas Keck. Their collaborative efforts have driven the development of innovative packaging solutions, showcasing the importance of teamwork and shared expertise in engineering and design.

Conclusion:

Ali Kaylan’s contributions to the innovation landscape are commendable. His four patents reflect his commitment to advancing packaging technology through creative and practical designs. As industries continue to evolve, Ali's work will undoubtedly play a critical role in shaping the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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