Endwell, NY, United States of America

Alfred T Rundle

This inventor holds 12 USPTO granted patents and 2 published patent applications. Top assignees: Lockheed Martin Corporation, International Business Machines Corporation, Graham Packaging Company, L.p.. Active years: 1993-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alfred T Rundle. Retrieved from https://idiyas.com/inventor/alfred-t-rundle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 58.3

Average Co-Inventor Count = 2.0

ph-index = 7

Forward Citations = 186(Granted Patents)


Company Filing History:


Years Active: 1993-2016

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12 patents (USPTO):Explore Patents

Title: Inventor Alfred T Rundle - Pioneering Innovations in Endwell, NY

Introduction: Alfred T Rundle is a distinguished inventor based in Endwell, NY, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Alfred T Rundle holds several patents in the areas of renewable energy technologies, sustainable materials, and advanced manufacturing processes, showcasing his commitment to driving progress through inventive solutions.

Career Highlights: With a career spanning over two decades, Alfred T Rundle has established himself as a visionary inventor, with a keen focus on developing environmentally friendly technologies that have the potential to revolutionize industries.

Collaborations: Throughout his career, Alfred T Rundle has collaborated with leading research institutions, universities, and companies to bring his inventions to life, fostering a culture of innovation and excellence in the process.

Conclusion: Alfred T Rundle's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, solidifies his position as a trailblazing inventor whose work continues to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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