Company Filing History:
Years Active: 2020-2023
Title: Alfred Bostick: Innovator in Electroplating Technology
Introduction
Alfred Bostick is a notable inventor based in Tigard, OR (US). He has made significant contributions to the field of electroplating, holding a total of 3 patents. His innovative work focuses on improving the efficiency and effectiveness of electroplating processes.
Latest Patents
One of Alfred Bostick's latest patents involves a unique electroplating apparatus designed to remove bubbles from plating cells. This apparatus features an electrode positioned at the bottom of a chamber, along with an ionically resistive element that has horizontally arranged through holes at the top. A membrane is situated in the middle of the chamber, with one or more panels extending vertically and parallelly from the membrane to the element. These panels create multiple regions between the membrane and the element. A substrate with a protuberance extends along a chord of the substrate, making contact with the top surface of the element above a designated region. The electrolyte flows between the substrate and the element, descending into the first region through the through holes on one side of the protuberance and ascending from the first region via the through holes on the opposite side. This innovative design effectively forces air bubbles out from the portion of the element associated with the first region.
Career Highlights
Alfred Bostick is currently employed at Lam Research Corporation, where he continues to develop and refine his electroplating technologies. His work has been instrumental in advancing the capabilities of electroplating processes, making them more efficient and reliable.
Collaborations
Alfred has collaborated with several talented individuals in his field, including Stephen J Banik and Bryan L Buckalew. These collaborations have contributed to the successful development of his innovative technologies.
Conclusion
Alfred Bostick is a distinguished inventor whose work in electroplating technology has led to significant advancements in the industry. His innovative patents and collaborations highlight his commitment to improving electroplating processes.
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