Alferd Cofer

Title: Alferd Cofer: Innovator in Plasma Processing Technology

Introduction

Alferd Cofer is a notable inventor based in Fremont, CA, who has made significant contributions to the field of plasma processing technology. With a total of 3 patents to his name, Cofer has developed innovative methods that enhance the efficiency and effectiveness of substrate etching processes.

Latest Patents

Cofer's latest patents include a method titled "Notch stop pulsing process for plasma processing system." This invention outlines a technique for etching a substrate with a silicon layer in a plasma processing chamber. The method involves performing a main etch step and terminating it when a predefined etch depth of at least 70 percent of the silicon layer's thickness is achieved. Following this, an overetch step is performed, which includes alternating between two process steps with different power levels applied to the bottom electrode.

Another significant patent is focused on "Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate." This method optimizes etching by selecting and alternating between two plasma process recipes, each designed to enhance specific substrate etch characteristics while managing trade-offs between them.

Career Highlights

Alferd Cofer is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His work at Lam Research has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in plasma processing technologies.

Collaborations

Cofer has collaborated with talented coworkers such as Tamarak Pandhumsoporn and Adrian Kiermasz. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the field.

Conclusion

Alferd Cofer's contributions to plasma processing technology through his patents and work at Lam Research Corporation highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of substrate etching processes.