Changwon, South Korea

Alexei V Tikhonov

This inventor holds 1 USPTO granted patent. Top assignee: Lg Electronics Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexei V Tikhonov. Retrieved from https://idiyas.com/inventor/alexei-v-tikhonov

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Innovations by Alexei V Tikhonov in Heat Exchanger Technology.

Introduction

Alexei V Tikhonov is a notable inventor based in Changwon, South Korea. He has made significant contributions to the field of refrigeration technology, particularly through his innovative designs that enhance heat exchange performance.

Latest Patents

One of Tikhonov's key inventions is a heat exchanger for refrigerators. This invention features a simple structure that improves heat exchange efficiency. The design includes refrigerant tubes with multiple straight and curved parts, arranged to form columns. Additionally, straight plate type fins are fitted to the refrigerant tubes, enhancing the overall performance of the heat exchanger.

Career Highlights

Tikhonov is currently associated with LG Electronics Inc., where he continues to develop cutting-edge technologies in refrigeration. His work has been instrumental in advancing the efficiency of heat exchangers, which are critical components in modern refrigeration systems.

Collaborations

He collaborates with talented coworkers, including Young Won Jeong and Seong Hae Jeong, who contribute to the innovative projects at LG Electronics Inc.

Conclusion

Alexei V Tikhonov's contributions to heat exchanger technology exemplify the importance of innovation in the refrigeration industry. His work not only enhances product performance but also reflects the ongoing advancements in engineering and design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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