Alexander Schoenhals

Title: Alexander Schoenhals: Micromechanical Sensor Innovation

Introduction

Alexander Schoenhals is an inventor associated with Reutlingen, Germany, and Robert Bosch. His listed patent concerns a production method for micromechanical sensor apparatuses that integrates MEMS sensor devices with ASIC switching devices.

Latest Patents

Schoenhals is credited with 1 patent: “Production Method for a Micromechanical Sensor Apparatus, and Corresponding Micromechanical Sensor Apparatus.” The invention describes forming a bonded wafer stack containing an ASIC wafer and a MEMS wafer, with corresponding switching and sensor devices positioned together to create individual sensor apparatuses.

The method also uses a packaging wafer with blind holes aligned to the MEMS sensor devices’ detection regions. After bonding the packaging wafer to the stack so the holes connect with those regions, the packaging wafer is back-thinned to expose the holes. This approach supports the packaging and manufacture of micromechanical sensors.

Career Highlights

Schoenhals’s listed patent connects his inventive work with Robert Bosch, a company active in engineering and technology. The patent focuses on wafer-level integration and packaging for micromechanical sensor apparatuses.

Collaborations

Mohammad Abbasi Gavarti and Andreas Menzel are identified as Schoenhals’s coworkers. The available information does not specify their roles in the patent or whether they collaborated directly on it.

Conclusion

Alexander Schoenhals’s listed invention addresses the integration and packaging of MEMS sensors and ASIC switching devices, highlighting a manufacturing approach for micromechanical sensor apparatuses.