Dorfen, Germany

Alexander Riedl

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander Riedl. Retrieved from https://idiyas.com/inventor/alexander-riedl-od94a49i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:

goldMedal1 out of 834,570 
Other
 patents

Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Alexander Riedl: Innovator in Gasket Technology

Introduction

Alexander Riedl is a notable inventor based in Dorfen, Germany. He has made significant contributions to the field of gasket technology, particularly with his innovative designs that enhance performance and reliability.

Latest Patents

Riedl holds a patent for a "Low stress to seal gasket." This invention features a multilayer, unitary gasket that includes at least one inner layer of expanded PTFE. This inner layer is positioned between a first and a second substantially air impermeable outer layer. The gasket is designed to form a substantially air impermeable seal when compressed at low stress, making it a valuable advancement in sealing technology.

Career Highlights

Throughout his career, Riedl has focused on developing solutions that improve the efficiency and effectiveness of sealing systems. His work has been recognized for its innovative approach and practical applications in various industries.

Collaborations

Riedl has collaborated with notable professionals in his field, including Raymond B. Minor and Kevin Edward Dove. These partnerships have contributed to the development and refinement of his inventions.

Conclusion

Alexander Riedl's contributions to gasket technology exemplify the spirit of innovation. His patent for a low-stress sealing gasket showcases his commitment to enhancing product performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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