Dayton, OH, United States of America

Alexander M Watson


Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Chesterfield, VA (US) (2015)
  • Dayton, OH (US) (2022 - 2023)
  • Kettering, OH (US) (2024)

Company Filing History:


Years Active: 2015-2024

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4 patents (USPTO):Explore Patents

Title: Innovations of Alexander M Watson

Introduction

Alexander M Watson is a notable inventor based in Dayton, OH (US). He has made significant contributions to the field of conductive materials and their applications. With a total of 4 patents, Watson's work showcases his innovative approach to technology and engineering.

Latest Patents

Watson's latest patents include groundbreaking inventions such as "Electrowetting Assisted Selective Printing" and "Articles Comprising Core Shell Liquid Metal Encapsulate Networks and Method to Control Alternating Current Signals and Power." The first patent describes an extrusion printing process for conductive materials, which involves attaching a counter-electrode to a substrate and applying a drive voltage to extrude conductive material. The conductive material used can range from metals with melting points between about −20° C. to about 150° C. The second patent focuses on methods to control AC signals and power using core shell liquid metal encapsulate networks, allowing for manipulation of various AC system properties under strain.

Career Highlights

Throughout his career, Watson has worked with esteemed organizations, including the United States of America as represented by the Secretary of the Air Force. His innovative contributions have been recognized in various technological advancements.

Collaborations

Watson has collaborated with notable individuals such as Christopher E Tabor and Carl J Thrasher, further enhancing the impact of his inventions.

Conclusion

Alexander M Watson's innovative work in conductive materials and AC signal control demonstrates his significant role in advancing technology. His patents reflect a commitment to pushing the boundaries of engineering and innovation.

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