Company Filing History:
Years Active: 2021-2023
Title: Innovations by Alexander Lucero Laylo
Introduction
Alexander Lucero Laylo is an accomplished inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device packaging.
Latest Patents
His latest patents include advancements in semiconductor packages and methods of packaging semiconductor devices. One embodiment describes a device that features a first die with both first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) on a package substrate, while the first die surface includes a first die contact pad. The device also incorporates a first clip bond that connects to the first die contact pad and a first substrate bond pad, ensuring a reliable connection. Additionally, the device utilizes a conductive bonding layer with spacers to maintain a uniform Bond Line Thickness (BLT).
Career Highlights
Alexander is currently employed at Utac Headquarters Pte. Ltd., where he continues to develop innovative solutions in semiconductor technology. His work focuses on enhancing the efficiency and reliability of semiconductor devices through advanced packaging methods.
Collaborations
He collaborates with talented coworkers, including Tanawan Chaowasakoo and Hua Hong Tan, who contribute to the innovative environment at Utac Headquarters Pte. Ltd.
Conclusion
Alexander Lucero Laylo's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the development of advanced semiconductor devices.