Rochester, MI, United States of America

Alexander Landuyt

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ti Group Automotive Systems Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander Landuyt. Retrieved from https://idiyas.com/inventor/alexander-landuyt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Alexander Landuyt: Inventor of a Fluid-Line Connection Arrangement

Introduction

Alexander Landuyt is an inventor associated with Rochester, Michigan, and Ti Group Automotive Systems Corporation. His patent work addresses secure connections for tubes used in fluid lines.

Latest Patents

Landuyt is credited with 1 patent: “Connection Arrangement Device and Method for Fluid Line.” The invention describes an adapter body with a passage bore and at least two outlets, together with a mating block containing a channel for receiving the adapter body. A retention feature on the adapter body interacts with a mating feature inside the channel, helping secure the adapter body in place when coupled to the mating block.

Career Highlights

The patent reflects work on fluid-line connection technology, with a focus on retaining components securely within an assembly. Landuyt is associated with Ti Group Automotive Systems Corporation.

Collaborations

The provided information identifies Benjamin Allen Sprygada and Jonathan Brock as Landuyt’s coworkers. Their specific roles in the patent or related work are not specified.

Conclusion

Alexander Landuyt’s recorded invention focuses on a secure adapter-and-mating-block arrangement for fluid lines, contributing to connection technology associated with his work at Ti Group Automotive Systems Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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