Company Filing History:
Years Active: 2019-2021
Title: Alexander Harvey Scheuermann: Innovator in Semiconductor Packaging
Introduction
Alexander Harvey Scheuermann is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to protective shell structures.
Latest Patents
His latest patents include "3D-printed protective shell structures with support columns for stress sensitive circuits" and "3D-printed protective shell structures for stress sensitive circuits." Both patents describe a semiconductor package that features a lead frame, with a semiconductor die attached to one side. The protective shell, which covers a portion of the semiconductor die, is made from ink residue. Additionally, a layer of molding compound encases the outer surface of the protective shell and the exposed part of the semiconductor die. A cavity space is also present within the inner space of the protective shell, enhancing the functionality of the semiconductor package.
Career Highlights
Alexander is currently employed at Texas Instruments Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of stress-sensitive circuits.
Collaborations
He has collaborated with notable coworkers such as James Cooper Wainerdi and Luu Thanh Nguyen, contributing to a dynamic and innovative work environment.
Conclusion
Alexander Harvey Scheuermann's contributions to semiconductor packaging through his patents reflect his commitment to innovation in technology. His work at Texas Instruments Corporation positions him as a key player in the advancement of protective shell structures for sensitive circuits.
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