Columbus, OH, United States of America

Alexander B Channell

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Edison Welding Institute, Inc.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander B Channell. Retrieved from https://idiyas.com/inventor/alexander-b-channell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Alexander B Channell: Innovator in Ultrasonic Packaging Technology

Introduction

Alexander B Channell is a notable inventor based in Columbus, OH (US). He has made significant contributions to the field of packaging technology, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and effectiveness of package sealing systems.

Latest Patents

Channell holds a patent for a "Modular ultrasonic device for use in package sealing systems." This ultrasonic module features a moveable front jaw and an elongated sonotrode with a sealing face that measures at least 12 inches (30.48 cm) in width. The design includes a moveable rear jaw and an anvil that works in conjunction with the sonotrode to ensure a reliable seal for packages.

Career Highlights

Channell is currently employed at the Edison Welding Institute, Inc., where he continues to develop and refine technologies related to ultrasonic sealing. His expertise in this area has positioned him as a key player in advancing packaging solutions.

Collaborations

Channell has collaborated with talented individuals such as Mitch Matheny and Sean T Flowers, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Alexander B Channell's contributions to ultrasonic packaging technology exemplify his commitment to innovation in the field. His patent and ongoing work at the Edison Welding Institute, Inc. highlight his role as a significant inventor in modern packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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