Location History:
- Hsinchu, TW (2001)
- Jubei, TW (2004)
Company Filing History:
Years Active: 2001-2004
Title: Innovations by Alex Fahn in Semiconductor Technology
Introduction
Alex Fahn is a notable inventor based in Jubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approaches to manufacturing processes.
Latest Patents
Fahn's latest patents include a "Method of making tall flip chip bumps" and a "Method for removing solder bodies from a semiconductor wafer." The first patent describes a method for creating electrically conductive bumps of improved height on a semiconductor device. This method involves several steps, including depositing under bump metallurgy, patterning a photoresist layer, and applying a flux agent to enhance the bump's height. The second patent outlines a technique for removing solder bodies connected to a semiconductor wafer through a copper wetting layer. This method utilizes an etchant that selectively dissolves the copper wetting layer, allowing for the separation of solder bodies from bond pads.
Career Highlights
Alex Fahn is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor manufacturing. His work has contributed to advancements in the efficiency and quality of semiconductor devices.
Collaborations
Fahn has collaborated with notable colleagues, including Chiou-Shian Peng and Kenneth Lin, who have also made significant contributions to the field.
Conclusion
Alex Fahn's innovative patents and contributions to semiconductor technology highlight his role as a leading inventor in the industry. His work continues to influence advancements in manufacturing processes, showcasing the importance of innovation in technology.