Murray, UT, United States of America

Alex Buckalew

This inventor holds 2 USPTO granted patents. Top assignee: Zagg Intellectual Property Holding Co., Inc.. Active years: 2012-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alex Buckalew. Retrieved from https://idiyas.com/inventor/alex-buckalew

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 40(Granted Patents)


Company Filing History:


Years Active: 2012-2013

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Alex Buckalew: Innovator in Mobile Technology

Introduction

Alex Buckalew is a notable inventor based in Murray, UT (US). He has made significant contributions to the field of mobile technology, holding a total of 2 patents. His work focuses on enhancing the functionality and usability of mobile computing devices.

Latest Patents

Among his latest patents are a protective cover for a mobile computing device and an antenna insulator for mobile telephone edges. These innovations reflect his commitment to improving user experience and device performance in the rapidly evolving tech landscape.

Career Highlights

Alex Buckalew is currently employed at Zagg Intellectual Property Holding Co., Inc. His role at the company allows him to leverage his inventive skills to develop cutting-edge solutions for mobile technology.

Collaborations

He collaborates with talented individuals in his field, including his coworker Jordan Keith Melville. Their combined expertise contributes to the innovative projects at Zagg.

Conclusion

Alex Buckalew's contributions to mobile technology through his patents and work at Zagg Intellectual Property Holding Co., Inc. highlight his role as a key innovator in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…