Puebla, Mexico

Alejandro Isunza

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Schaeffler Technologies Ag & Co. Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alejandro Isunza. Retrieved from https://idiyas.com/inventor/alejandro-isunza

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Alejandro Isunza and Junction Box Electromagnetic Compatibility

Introduction

Alejandro Isunza is an inventor associated with Puebla, Mexico, and Schaeffler Technologies AG & Co. KG. His patent work addresses electromagnetic compatibility in junction box assemblies.

Latest Patents

Isunza is associated with 1 patent: “Cover Tabs for Electromagnetic Compatibility in Junction Box.” The invention describes a junction box assembly with contact tabs positioned between cover fasteners. These tabs help maintain electrical contact between the cover and housing, supporting electromagnetic compatibility even when fasteners are spaced farther apart. This design can allow fewer fasteners or more flexible fastener placement, potentially making junction boxes lighter, easier to assemble, and less costly.

Career Highlights

The available information connects Isunza’s inventive work with Schaeffler Technologies AG & Co. KG. His patent focuses on a practical design improvement for junction box construction.

Collaborations

Christopher Chapanar and Kyle Nelson are identified as Isunza’s coworkers. The provided information does not specify their roles in the patent.

Conclusion

Alejandro Isunza’s patent presents a contact-tab approach to maintaining electromagnetic compatibility while enabling more flexible and efficient junction box assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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