US

Albert E Cranston

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Albert E Cranston. Retrieved from https://idiyas.com/inventor/albert-e-cranston-gv53l459

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

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Title: Albert E Cranston: Innovator in Bundling Technology

Introduction

Albert E Cranston is an inventive mind based in the United States. He is known for his contributions to the field of bundling technology. His innovative approach has led to the development of a unique apparatus and method for securing bundles with a strap.

Latest Patents

Cranston holds a patent for an "Apparatus And Method For Securing A Bundle With A Strap." This invention involves a method and apparatus for binding a bundle using an elongate flat strap that has a heat-sensitive adhesive. The apparatus includes mechanisms for driving the strap in a loop around the bundle, a gripper for holding an end of the strap, and mechanisms for drawing the strap taut around the bundle. Additionally, heated press elements are used to clamp adjacent overlapping portions of the strap together, activating the adhesive to bond the sections. A cutter is also included to sever the remaining portions of the strap.

Career Highlights

Cranston is associated with Cranston Diversified Industries, Inc., where he has made significant contributions to the company's innovative projects. His work has focused on improving the efficiency and effectiveness of bundling processes.

Collaborations

Cranston has collaborated with Bobbie Don Peacock, working together to enhance the development of their bundling technology.

Conclusion

Albert E Cranston's innovative contributions to bundling technology demonstrate his commitment to advancing methods in this field. His work continues to influence the industry and improve bundling processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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