Alan Paul Stadnik

Title: Alan Paul Stadnik: Innovator in Additive Printing and Electronic Module Design

Introduction

Alan Paul Stadnik, a notable inventor based in Hanau, Germany, has made significant contributions to the fields of additive printing and electronic modules. With a total of 2 patents to his name, Stadnik's work focuses on enhancing both the printing processes and the functional performance of electronic components.

Latest Patents

Stadnik's latest inventions include an innovative additive printing method aimed at depositing a functional print pattern on the surface of three-dimensional objects. This method involves several meticulous steps, such as providing the object on a planar surface, generating 3D geometrical surface data, and determining the precise amount of printing fluid to be discharged from the print nozzles. A key feature of this technique is the inclusion of data correction steps to ensure accuracy in the printing process.

In addition, Stadnik developed a patent for electromagnetic interference shielding in electronic modules. This patented design incorporates a dielectric material with recesses between electronic components, providing an effective way to cover these components while maintaining operational integrity. The innovative use of conductive layers in the recesses demonstrates Stadnik's ability to integrate functionality with sophisticated material science.

Career Highlights

Alan Paul Stadnik is currently affiliated with Heraeus Deutschland GmbH & Co. KG, a prominent technology and materials company. His work within the company underscores his commitment to innovation and collaboration in advancing technology.

Collaborations

In his pursuit of innovation, Stadnik collaborates with talented individuals such as Susanne Behl and Holger Albert Ulland. This collaborative environment not only amplifies creativity but also enhances the development of cutting-edge technologies within the organization.

Conclusion

Alan Paul Stadnik stands out as a pivotal figure in the realm of innovation, particularly in additive printing and electronic module design. With his continued dedication to research and development, he is poised to make further significant contributions to the technological landscape.