Tadley, United Kingdom

Alan Brown

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nexans. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alan Brown. Retrieved from https://idiyas.com/inventor/alan-brown-cmbc5xgr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Alan Brown - Innovator in Connection Technology

Introduction

Alan Brown is a notable inventor based in Tadley, GB. He has made significant contributions to the field of connection technology, particularly with his innovative designs that enhance connectivity solutions.

Latest Patents

One of Alan Brown's key inventions is the "Clippable interconnection module and associated connection cord." This interconnection module serves as a bridge between a connection cord and a connection panel. It comprises a pair of spring-loaded conductive pins and a molded body in which a portion of the pins is embedded. At least one end of each pin projects from the body, which forms a hollow volume, making the module clippable. This design not only improves functionality but also enhances user convenience.

Career Highlights

Throughout his career, Alan has worked with several prominent companies, including Nexans and Aginode Group. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Alan has collaborated with talented individuals such as Colin Statham and Martin Rossbach. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Alan Brown's contributions to connection technology through his innovative patents and collaborations highlight his role as a significant figure in the field. His work continues to influence the way we approach connectivity solutions today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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