Palatine, IL, United States of America

Al Ocken


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 1993

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2 patents (USPTO):Explore Patents

Title: Al Ocken: Innovator in Electronic Module Assembly

Introduction

Al Ocken is a notable inventor based in Palatine, IL (US). He has made significant contributions to the field of electronic module assembly, holding a total of 2 patents. His work has been instrumental in advancing the technology used in electronic devices.

Latest Patents

One of Al Ocken's latest patents is for an electronic module assembly and method of forming the same. This invention involves creating a one-piece electronic module assembly from a substantially rectangular baseplate. An insulating film is mounted on the baseplate to carry circuit components. The assembly process includes providing a pair of major bend axes across the baseplate and forming inwardly extending notches at selected locations along the lengthwise edges. The baseplate is bent at these notches to create a front wall, a pair of sidewalls, and tabs that overlap the sidewalls. Finally, the baseplate is bent over on itself along the major bend axes and sealed, if necessary, to complete the assembly.

Career Highlights

Al Ocken has had a distinguished career, working at Motorola Corporation, where he has applied his innovative ideas to develop new technologies. His expertise in electronic module assembly has positioned him as a key player in the industry.

Collaborations

Throughout his career, Al has collaborated with talented individuals such as Timothy S. Fisher and Michael I. Petrites. These collaborations have further enhanced his work and contributed to the success of his inventions.

Conclusion

Al Ocken's contributions to electronic module assembly demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic devices, making him a significant figure in the field of invention.

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