Akito Ichikawa

Title: Akito Ichikawa: Innovator in Semiconductor Manufacturing

Introduction

Akito Ichikawa is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent that addresses the challenges of handling thinned semiconductor chips.

Latest Patents

Ichikawa holds a patent for a "Method for manufacturing semiconductor chip." This invention focuses on the process of manufacturing thinned semiconductor chips by grinding a semiconductor wafer supported on a rigid support substrate. The method allows for the removal of the semiconductor wafer or chips from the support substrate without causing damage. The semiconductor wafer is bonded to a light-transmissive support substrate through an adhesive layer that reduces its adhesion force upon exposure to light radiation. This innovative approach enables the back surface of the semiconductor wafer to be exposed, facilitating the cutting of the wafer into individual chips while maintaining their integrity.

Career Highlights

Throughout his career, Akito Ichikawa has worked with prominent companies, including Kansai Paint Company, Ltd. and Disco Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and manufacturing processes.

Collaborations

Ichikawa has collaborated with notable colleagues such as Kouji Takezoe and Koichi Tamura. Their combined efforts in the field of semiconductor manufacturing have led to advancements that benefit the industry.

Conclusion

Akito Ichikawa's contributions to semiconductor manufacturing through his innovative patent demonstrate his commitment to advancing technology in this critical field. His work continues to influence the way semiconductor chips are produced and handled, ensuring greater efficiency and reliability in the industry.