Osaka, Japan

Akira Teraoka

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 2.0

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • Takaishi, JP (1981)
  • Sennan, JP (1986)
  • Sakai, JP (1989)
  • Osaka, JP (1983 - 2022)

Company Filing History:


Years Active: 1981-2022

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7 patents (USPTO):Explore Patents

Title: Akira Teraoka: Innovator in Fiber Reinforcement and X-ray Inspection Technologies

Introduction

Akira Teraoka is a prominent inventor based in Osaka, Japan. He has made significant contributions to the fields of material science and electronic device inspection. With a total of 7 patents to his name, Teraoka's work has had a lasting impact on various industries.

Latest Patents

One of Teraoka's latest patents is a fiber material for cement reinforcement. This innovative material incorporates a resin A containing an isocyanate compound within a fiber bundled body, while a resin B with an epoxy resin is present on the surface. The invention also includes a concrete or mortar molded article that utilizes this fiber material for reinforcement. Another notable patent is an X-ray inspection method and apparatus designed for evaluating the mounting conditions of electronic devices. This technology allows for precise judgment of solder ball connections in increasingly compact and dense circuit boards.

Career Highlights

Throughout his career, Teraoka has worked with reputable companies such as Kubota Corporation and Techno Enami Corporation. His experience in these organizations has contributed to his expertise in developing advanced materials and inspection technologies.

Collaborations

Teraoka has collaborated with notable individuals in his field, including Tadashi Nakamura and Genichi Funabashi. These partnerships have further enhanced his innovative capabilities and broadened the scope of his work.

Conclusion

Akira Teraoka's contributions to fiber reinforcement and X-ray inspection technologies exemplify his dedication to innovation. His patents reflect a commitment to advancing material science and electronic device inspection, making him a significant figure in his field.

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