Osaka, Japan

Akira Nagaosa

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Rengo Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Nagaosa. Retrieved from https://idiyas.com/inventor/akira-nagaosa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 11.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Akira Nagaosa: Innovator in Packaging Solutions

Introduction

Akira Nagaosa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of packaging through his innovative designs. His work focuses on creating efficient and practical solutions for product packaging.

Latest Patents

Nagaosa holds a patent for a "Box for packing and exhibiting product, and packing device therefor." This invention features a box that includes a front receiving panel, a bottom surface panel, a rear surface panel, a top surface panel, and a front surface panel that are integrally connected. Each pair of bottom side panels, rear side panels, top side panels, and front side panels are also integrally connected to the respective sides of the bottom, rear, top, and front surface panels. The design includes a tray portion and a lid portion, with a cut line for separating the two.

Career Highlights

Nagaosa is associated with Rengo Co., Ltd., a company known for its expertise in packaging solutions. His work has contributed to the advancement of packaging technology, making it more user-friendly and efficient.

Collaborations

Nagaosa has collaborated with notable colleagues, including Yoichi Nishikawa and Atsuo Ishikawa. Their teamwork has fostered innovation and creativity in their projects.

Conclusion

Akira Nagaosa's contributions to packaging design exemplify the importance of innovation in everyday products. His patent reflects a commitment to improving functionality and user experience in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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