Kyoto, Japan

Akira Menjiu

This inventor holds 1 USPTO granted patent. Top assignee: Unitika Ltd.. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Menjiu. Retrieved from https://idiyas.com/inventor/akira-menjiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1989

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Akira Menjiu: Innovator in Fine Amorphous Metal Wire

Introduction

Akira Menjiu is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly with his innovative work on fine amorphous metal wire. His inventions have the potential to enhance various applications in technology and manufacturing.

Latest Patents

Menjiu holds a patent for a fine amorphous metal wire characterized by a circular cross-section. This wire exhibits improved toughness and is composed according to a specific formula. His invention represents a significant advancement in the properties of metal wires, making them more suitable for demanding applications.

Career Highlights

Menjiu is associated with Unitika Ltd., a company known for its commitment to innovation and quality in materials. His work at Unitika has allowed him to explore new frontiers in material development, contributing to the company's reputation as a leader in the industry.

Collaborations

Throughout his career, Menjiu has collaborated with talented individuals such as Michiaki Hagiwara and Nomura Kohachi. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Akira Menjiu's contributions to the field of fine amorphous metal wire exemplify the spirit of innovation. His work not only advances material science but also paves the way for future developments in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…