Nobeoka, Japan

Akira Ito

This inventor holds 1 USPTO granted patent. Top assignee: Asahi Kasei Kogyo Kabushiki Kaisha. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Ito. Retrieved from https://idiyas.com/inventor/akira-ito-v4mgyw7w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Akira Ito and Polyamide Composition Innovation.

Introduction

Akira Ito is an inventor associated with Nobeoka, Japan, and Asahi Kasei Kogyo Kabushiki Kaisha. The supplied information credits Ito with 1 patent concerning a polyamide composition designed to combine improved molding properties with durable physical performance.

Latest Patents

Ito’s listed patent, “Polyamide Composition,” describes a material containing an aromatic ring-containing polyamide resin and a specified amount of an aliphatic polyester. The composition is intended to improve molding characteristics, including mold release, while maintaining stiffness when exposed to moisture. It may also include components that enhance properties such as Izod impact strength and hinge performance without sacrificing its molding benefits. The invention is described as suitable for molding applications in industries including automotive, electrical, and electronics.

Career Highlights

Ito’s listed invention reflects work on polymer materials and their practical processing and performance requirements. The patent associates the work with Asahi Kasei Kogyo Kabushiki Kaisha.

Collaborations

Tetsuo Hamada and Sadayuki Yakabe are identified as Ito’s coworkers. The supplied information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Akira Ito’s listed patent presents a polyamide composition intended to support easier molding while retaining useful physical properties, with potential applications across several industrial fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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