Akira Ando

Title: Akira Ando: Innovator in Synthetic Resin Moulding

Introduction

Akira Ando is a notable inventor based in Kobe, Japan. He has made significant contributions to the field of synthetic resin technology, particularly in the moulding of foamed synthetic resin pellets. His innovative methods have paved the way for advancements in material science.

Latest Patents

One of Akira Ando's key patents is titled "Method of moulding foamed synthetic resin pellets of polyolefine." This patent describes a method where synthetic resin pellets are prepared with a volume of closed cells exceeding 65% of the total volume. The process involves using an inorganic gas in the cells at a pressure higher than 1.18 atmospheres. The pellets are then filled into a mould that is not completely gas-tight and heated to expand and adhere tightly to each other. The moulding process can occur at pressures lower than ordinary pressure or even in a vacuum. The final product can be removed from the mould after cooling or during cooling when the inner temperature is between its melting point and 50 degrees Celsius below the melting point. The resulting product can be stored at temperatures ranging from 30 to 70 degrees Celsius below the melting point. Akira Ando holds 1 patent.

Career Highlights

Akira Ando is associated with Kanegafuchi Kagaku Kogyo Kabushiki Kaisha, a company known for its innovations in chemical engineering and materials science. His work has significantly impacted the industry, particularly in the development of new materials and processes.

Collaborations

Throughout his career, Akira Ando has collaborated with notable colleagues, including Itaru Hatano and Minoru Hara. These collaborations have fostered a creative environment that has led to further advancements in their respective fields.

Conclusion

Akira Ando's contributions to the field of synthetic resin moulding exemplify the spirit of innovation. His patented methods continue to influence the industry and inspire future developments in material science.