Location History:
- Kyoto, JP (2000)
- Yawata, JP (2008)
Company Filing History:
Years Active: 2000-2008
Title: Akio Ochi: Innovator in Laminated Circuit Board Technology
Introduction
Akio Ochi is a notable inventor based in Yawata, Japan. He has made significant contributions to the field of electronics, particularly in the development of laminated circuit boards. With a total of 2 patents, Ochi's work has enhanced the reliability and efficiency of electronic components.
Latest Patents
Ochi's latest patents include a laminated circuit board and its manufacturing method, as well as a manufacturing method for a module using the laminated circuit board and its manufacturing apparatus. The laminated circuit board features electronic components embedded within it, comprising a substrate with a land connected and fixed by solder to an integrated circuit. A sheet is laminated on the upper surface of the substrate, and a filling portion by fluid resin is formed around the integrated circuit. The sheet maintains its shape through woven or non-woven cloth, which is impregnated with heat-fluid resin and thermally compressed. This innovative design enhances the electrical and mechanical connections between the laminated circuit board and electronic components, improving reliability.
Career Highlights
Ochi is currently employed at Matsushita Electric Industrial Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in advancing the manufacturing processes of electronic components.
Collaborations
Throughout his career, Ochi has collaborated with esteemed colleagues such as Junichi Kimura and Toshihiro Nishii. These partnerships have fostered innovation and contributed to the success of various projects.
Conclusion
Akio Ochi's contributions to laminated circuit board technology exemplify his commitment to innovation in the electronics industry. His patents reflect a deep understanding of the complexities involved in electronic manufacturing, ensuring enhanced reliability for future applications.