The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2008
Filed:
Nov. 18, 2004
Junichi Kimura, Nishikasugai-gun, JP;
Toshihiro Nishii, Hirakata, JP;
Akio Ochi, Yawata, JP;
Shinji Harada, Katano, JP;
Junichi Kimura, Nishikasugai-gun, JP;
Toshihiro Nishii, Hirakata, JP;
Akio Ochi, Yawata, JP;
Shinji Harada, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.