Sodegaura, Japan

Aki Yamada



Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2024

Loading Chart...
Loading Chart...
7 patents (USPTO):Explore Patents

Title: Aki Yamada: Innovator in Polycarbonate-Based Resins

Introduction

Aki Yamada is a prominent inventor based in Sodegaura, Japan. He has made significant contributions to the field of materials science, particularly in the development of polycarbonate-based resins. With a total of seven patents to his name, Yamada's work has had a considerable impact on the industry.

Latest Patents

Yamada's latest patents include innovative advancements in polycarbonate-based resins. One of his notable inventions is a production method for a polycarbonate-based resin that features a ratio of an amine terminal to all terminal groups of 1.0 mol % or more. Additionally, he has developed a polycarbonate-based resin composition that includes a polycarbonate-polyorganosiloxane copolymer with specific characteristics, enhancing the material's properties for various applications.

Career Highlights

Aki Yamada is currently employed at Idemitsu Kosan Company, Limited, where he continues to push the boundaries of material innovation. His expertise in polycarbonate resins has positioned him as a key figure in the research and development sector of his company.

Collaborations

Yamada has collaborated with notable coworkers, including Yasuhiro Ishikawa and Koichi Suga. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Aki Yamada's contributions to the field of polycarbonate-based resins exemplify his dedication to innovation and excellence. His patents reflect a commitment to advancing material science, making him a significant figure in the industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…