Company Filing History:

23 out of 164,108

International Business Machines Corporation

where one patent can have more than one assignee

Years Active: 1995-2007

where 'Filed Patents' based on already Granted Patents

23 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 7227268 - Placement of sacrificial solder balls underneath the PBGA substrate (2007-06-05),

2. 6829149 - Placement of sacrificial solder balls underneath the PBGA substrate (2004-12-07),

3. 6674647 - Low or no-force bump flattening structure and method (2004-01-06),

4. 6559666 - Method and device for semiconductor testing using electrically conductive adhesives (2003-05-06),

5. 6492071 - Wafer scale encapsulation for integrated flip chip and surface mount technology assembly (2002-12-10),

6. 6453537 - Cooling method for electronic components (2002-09-24),

7. 6437254 - Apparatus and method for printed circuit board repair (2002-08-20),

8. 6353182 - Proper choice of the encapsulant volumetric CTE for different PGBA substrates (2002-03-05),

9. 6295724 - Apparatus for printed circuit board repair (2001-10-02),

10. 6288559 - Semiconductor testing using electrically conductive adhesives (2001-09-11),

11. 6268739 - Method and device for semiconductor testing using electrically conductive adhesives (2001-07-31),

12. 6255599 - Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination (2001-07-03),

13. 6115912 - Apparatus and method for printed circuit board repair (2000-09-12),

14. 6034875 - Cooling structure for electronic components (2000-03-07),

15. 6018866 - Apparatus and method for printed circuit board repair (2000-02-01),

Title: The Innovations of Ajit Kumar Trivedi

Introduction

Ajit Kumar Trivedi, based in Endicott, NY, is a prolific inventor with an impressive portfolio of 23 patents. His work predominantly focuses on advancing technologies in packaging related to flip chips and PBGA substrates, demonstrating his commitment to enhancing reliability in semiconductor manufacturing.

Latest Patents

Among his latest innovations is a patent concerning the placement of sacrificial solder balls underneath the PBGA substrate. This invention presents various techniques aimed at improving the reliability of flip packages that utilize underfill encapsulation. One embodiment details methods for packaging flip chips by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment focuses on the arrangement of layers within a laminate to optimize PBGA packaging based on the stiffness of each layer. Additionally, he introduces methods for incorporating one or more redundant interconnections at the bottom of the package substrate, ensuring that these interconnections are strategically placed within the shadow of the IC chip to enhance performance.

Career Highlights

Trivedi has made significant contributions to the field while working with renowned organizations, including the International Business Machines Corporation (IBM) and Sematech, Inc. His role at these companies has enabled him to drive innovation and implement his cutting-edge research into practical applications.

Collaborations

Throughout his career, Ajit Kumar Trivedi has collaborated with notable professionals in the industry, including coworkers Mark Vincent Pierson and Alan Harris Crudo. These collaborations have facilitated a dynamic exchange of ideas, further enhancing the quality and impact of his work in semiconductor packaging technology.

Conclusion

Ajit Kumar Trivedi's contributions to the field of semiconductor packaging through his 23 patents reflect his dedication to innovations that improve reliability and efficiency. His achievements and collaborations within notable organizations have established him as a leading figure in advancing the technology behind flip chip packaging.

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