The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Sep. 26, 2000
Applicant:
Inventors:
William E. Bernier, Endwell, NY (US);
Mark V. Pierson, Binghamton, NY (US);
Ajit K. Trivedi, Endicott, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 9/00 ; G03C 5/00 ; H01L 2/144 ;
U.S. Cl.
CPC ...
G03F 9/00 ; G03C 5/00 ; H01L 2/144 ;
Abstract
A device and process for applying mixtures of adhesive formulations combined with solder flux such that flip chips may be rapidly encapsulated with such combinations without interfering with subsequent wafer processing steps are provided. Also provided is a wafer stencil designed in such a manner that the saw kerf lines separating individual chip dies are protected from coming into contact with the formulation. Extrusion screening using such wafer stencil is also provided.