Baltimore, MD, United States of America

Aishwarya Pantula

This inventor holds 1 USPTO granted patent. Top assignee: Johns Hopkins University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Aishwarya Pantula. Retrieved from https://idiyas.com/inventor/aishwarya-pantula-2yhqmmk8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Aishwarya Pantula and Multisegmented Robot Innovation.

Introduction

Aishwarya Pantula is an inventor associated with Johns Hopkins University in Baltimore, Maryland. Her patent work includes a design for multisegmented robots that can move across a surface through cyclic changes in their shape.

Latest Patents

Pantula is named on one patent, 1 patent: “Multisegmented Robots and Networks of Multisegmented Robots.” The invention describes a robot with two or more separated segments connected by a tether. Each segment includes active material that cyclically swells and contracts in response to changing environmental stimuli, alongside passive material that can contact the surface beneath the robot. By giving the segments different frictional resistance over the stimulus cycle, the design produces translational movement. The patent also addresses networks of these robots.

Career Highlights

Pantula’s listed patent highlights research into soft, stimulus-responsive robotic systems. The design combines active materials, passive surface-contacting layers, and coordinated segment movement to enable crawling without relying on conventional rigid mechanisms.

Collaborations

Pantula’s patent work is associated with Johns Hopkins University. Siming Deng, identified as a woman, is listed as a coworker.

Conclusion

Aishwarya Pantula’s patent on multisegmented robots presents an approach to locomotion that uses responsive materials and differences in friction to generate movement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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