Company Filing History:
Years Active: 2024
Title: The Innovative Contributions of Ai Jing Lin
Introduction
Ai Jing Lin is a notable inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of electronics through her innovative designs and patents. Her work primarily focuses on enhancing the functionality and efficiency of circuit boards.
Latest Patents
Ai Jing Lin holds a patent for a circuit board and the method of manufacturing the same. This circuit board features a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer, and a heat dissipation element. The conductive metal layer is primarily used to transmit electronic signals. The insulating layer is connected to the conductive metal layer, while the thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer. This layer thermally contacts the conductive metal layer and is designed to conduct heat effectively. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, facilitating the transfer of heat to the outside through a heat dissipation channel.
Career Highlights
Ai Jing Lin is currently employed at Unimicron Technology Corporation, where she continues to innovate and develop advanced electronic components. Her expertise in circuit board technology has positioned her as a valuable asset to her company and the industry.
Collaborations
Some of her coworkers include Chung-Yu Lan and Jia Hao Liang, who collaborate with her on various projects within the company.
Conclusion
Ai Jing Lin's contributions to circuit board technology exemplify her innovative spirit and dedication to advancing electronic design. Her patent reflects her commitment to improving the efficiency and functionality of electronic components.