Company Filing History:
Years Active: 2005
Title: Innovations by Ahila Krishnamoorthy in Dual Damascene Structures
Introduction
Ahila Krishnamoorthy is an accomplished inventor based in Singapore, known for his contributions to the field of semiconductor technology. His innovative work focuses on improving interconnect reliability and performance through advanced fabrication methods.
Latest Patents
Ahila holds a patent titled "Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects." This patent describes an improved method of forming a dual damascene structure that incorporates an organosilicate glass (OSG) dielectric layer. The method follows a via-first process, where a via is formed in the OSG layer, preferably stopping on a silicon carbide (SiC) layer. The SiC layer is removed before stripping a photoresist containing the via pattern. A planarizing bottom anti-reflective coating (BARC) layer is formed in the via to protect the exposed substrate from damage during trench formation. This method enhances Kelvin via and via chain yields while avoiding damage to the OSG layer at the top corners of the via and trench. Additionally, it prevents pitting in the OSG layer at the trench bottom, achieving vertical sidewalls in the via and trench openings while maintaining via critical dimensions. The OSG loss during etching is minimized by removing the etch stop layer early in the dual damascene sequence.
Career Highlights
Ahila is currently employed at the Agency for Science, Technology and Research, where he continues to push the boundaries of semiconductor fabrication techniques. His work has significantly contributed to advancements in the field, making him a notable figure in the industry.
Collaborations
Ahila collaborates with talented colleagues, including Qiang Guo and Xiaomei Bu, who contribute to the innovative environment at the Agency for Science, Technology and Research.
Conclusion
Ahila Krishnamoorthy's innovative methods in semiconductor technology exemplify the importance of research and development in enhancing interconnect performance and reliability. His contributions are paving the way for future advancements in the field.