Adrian Chee Heong Koh

Title: Adrian Chee Heong Koh: Innovator in Semiconductor Packaging

Introduction

Adrian Chee Heong Koh is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is characterized by a focus on enhancing the functionality and efficiency of semiconductor devices.

Latest Patents

Adrian holds a patent titled "Semiconductor package having wettable lead flank and method of making the same." This invention involves a semiconductor package that comprises a lead frame, a chip, and a molding encapsulation. The lead frame includes one or more die paddles, a first plurality of leads, and a second plurality of leads. Each lead's end surface is plated with a metal, while specific windows on both sides of the leads remain unplated. The method for fabricating this semiconductor package includes providing a lead frame array, mounting a chip, forming a molding encapsulation, and applying a cutting or punching process. Adrian has 1 patent to his name.

Career Highlights

Adrian is currently employed at Alpha and Omega Semiconductor International LP, where he continues to push the boundaries of semiconductor technology. His role involves collaborating with a team of skilled professionals to develop innovative solutions that meet the demands of the industry.

Collaborations

Adrian has worked alongside talented colleagues such as Yan Xun Xue and Long-Ching Wang. Their combined expertise contributes to the advancement of semiconductor packaging technologies.

Conclusion

Adrian Chee Heong Koh is a distinguished inventor whose work in semiconductor packaging has made a significant impact in the field. His innovative patent and collaboration with skilled professionals highlight his commitment to advancing technology.