Yonkers, NY, United States of America

Adinath Shantinath Narasgond

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: International Business Machines Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Adinath Shantinath Narasgond. Retrieved from https://idiyas.com/inventor/adinath-shantinath-narasgond

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: Adinath Shantinath Narasgond

Introduction

Adinath Shantinath Narasgond, based in Yonkers, NY, is a notable inventor recognized for his contributions to the field of hybrid under-bump metallization components. His innovative work is pivotal in advancing semiconductor technology, particularly in enhancing device performance.

Latest Patents

Adinath holds a patent for a groundbreaking invention titled "Hybrid Under-Bump Metallization Component." This patent encompasses devices and methods that facilitate hybrid under-bump metallization components. The device features an under-bump metallization component comprising a superconducting interconnect component and a solder wetting component. Additionally, it includes a solder bump that connects to both the superconducting interconnect component and the solder wetting component. In certain embodiments, the superconducting interconnect component is designed to be hermetically sealed, marking a significant innovation in the field.

Career Highlights

Adinath Shantinath Narasgond serves as an inventor at the International Business Machines Corporation (IBM), a company renowned for its widespread impact on information technology and innovation. His role at IBM has allowed him to push the boundaries of technology, contributing to solutions that help meet the demands of modern electronics.

Collaborations

Throughout his career, Adinath has collaborated with esteemed colleagues such as Jae-Woong Nah and Eric Peter Lewandowski, forming a team dedicated to technological advancements in semiconductor design. These collaborations demonstrate the importance of teamwork in driving innovation and enhancing the performance of electronic devices.

Conclusion

Adinath Shantinath Narasgond's contributions to the field of hybrid under-bump metallization components exemplify the innovative spirit that drives technological advancement. His work at IBM, along with his collaborative efforts with notable peers, underscores his commitment to redefining the landscape of semiconductor technology. With his patent in hand, Adinath continues to pave the way for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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