Tampa, FL, United States of America

Adam L Bachmann

This inventor holds 1 USPTO granted patent. Top assignee: US Government as Represented by the Secretary of the Army. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Adam L Bachmann. Retrieved from https://idiyas.com/inventor/adam-l-bachmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Adam L. Bachmann and Laser-Folded 3D Electronics.

Introduction

Adam L. Bachmann is an inventor associated with Tampa, Florida, and the U.S. Government as represented by the Secretary of the Army. His work includes an invention for forming three-dimensional electronic structures from printed circuit boards.

Latest Patents

Bachmann is credited with 1 patent, titled “Laser Folded 3D Electronics.” The patent describes a method that uses a laser to fold a two-dimensional electrically insulating printed circuit board that is at least partially covered with a metal layer. By directing the laser onto the metal layer, the method creates one or more folds in the board, shaping it into a three-dimensional electronic device structure.

Career Highlights

The patent highlights an approach to producing three-dimensional electronics through laser-based folding. It describes using the laser to form the structure directly from a printed circuit board, rather than relying solely on conventional assembly methods.

Collaborations

Bachmann’s listed coworker is Michael D. Dickey. The patent is associated with the U.S. Government as represented by the Secretary of the Army.

Conclusion

Adam L. Bachmann’s patent presents a laser-folding method for transforming a two-dimensional printed circuit board into a three-dimensional electronic device structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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